Documents
Documents
Design Support
Application Notes
Software
| Features | Details |
|---|---|
| SoC/FPGA | Virtex™ UltraScale+™ FPGA with B2104 Package Compatible with: Virtex™ UltraScale+™: VU13P, VU11P, VU9P, VU7P, VU5P devices, Kintex™ UltraScale+™: KU19P devices, Virtex™ UltraScale™: VU080, VU095, VU125, VU160, VU190 devices and Kintex™ UltraScale™: KU095, KU115 devices System Logic cells up to 3,780K Logic cells and up to 3,456K Configurable Logic Blocks. Gen3 x16/ Gen4x8 Integrated PCIe block 100G Ethernet MAC cores for high-speed connectivity |
| OSM | Dual 64-bit Arm Cortex-A72 microprocessor subsystem at up to 2.0 GHz 4× Arm Cortex-R5F MCUs (up to 1.0GHz) OSM module with Size-M “Medium” and Height “Flat” 32bit 2GB LPDDR4 (Expandable) 16GB eMMC Flash 2Kb EEPROM High-speed SerDes(PCIe Gen3/ USB3.0/2.5G SGMII) x 4 |
| Memory | Dual 64bit, 4GB DDR4 with ECC for FPGA 32bit, 2GB DDR4 for FPGA 128MB QSPI Flash for FPGA 512KB SRAM via OSM SPI 2Kb EEPROM |
| Storage | 128MB QSPI Flash for FPGA |
| FPGA to OSM Interfaces | RGMII x1 SPI x1 UART x1 PCIe x2 Gen3 |
| Board to Board Connector Interfaces | From FPGA :
From OSM:
|
| Other On SOM Features | TPM2.0 module 10G Ethernet PHY Transceiver Clock Synthesizer Temperature Sensor Fan Header |
| Software Features |
|
| General Features |
|

- Dual Stacked QSFP112G Connector for 40G/100G Ethernet interfaces
- Dual FMC+ HSPC Connector with high-speed transceivers and high-performance FPGA IOs
- FMC+ HSPC connector with high-performance and high-density FPGA IOs
- PCIe x16 Connector for PCIe x16 Gen3/PCIe x8 Gen4
- 12G SDI Video IN through HD BNC Connector
- 12G SDI Video OUT through HD BNC Connector
- 4K HDMI 2.0 IN through HDMI Connector
- 4K HDMI 2.0 OUT through HDMI Connector
- PMOD Connector for FPGA IOs
- USB TypeC for debug and JTAG interfaces
- USB 2.0 & USB3.0 through TypeC Connector from OSM
- 10G Ethernet through RJ45 Magjack from OSM
- Gigabit Ethernet through RJ45 Magjack from OSM
- Micro SD connector for booting of OSM
- Coin cell battery connector for RTC backup power
- Boot media controlling DIP switch and Hard Reset Switch
- Operating Temperature: -20°C to +70°C
- Form Factor: 210mm x 160mm


For any highly integrated System on Modules, thermal design is very important factor. iWave Supports Fan Sink solution for Virtex™/Kintex™ UltraScale+™ SoM.



