Virtex™/Kintex™ UltraScale+™System on Module

iG-G52M®

  • Virtex™ UltraScale+™ (VU13P/VU11P/VU9P/VU7P/VU5P) & Kintex™ UltraScale+™ (KU19P)
  • OSM module with Dual Cortex-A72 @ 2.0GHz / 4× Cortex-R5F
  • Up to 3,780K Logic cells & 1,728K LUTs
  • 74 GTY transceivers up to 32Gbps
  • Integrated PCIe Gen3 x16 / Gen4 x8
  • 100G Ethernet MAC cores for high-speed connectivity
  • Form factor 90mm x 120mm (BRYN+) with 40°C to +85°C (Industrial)
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Features Details
SoC/FPGA Virtex™ UltraScale+™ FPGA with B2104 Package
Compatible with: Virtex™ UltraScale+™: VU13P, VU11P, VU9P, VU7P, VU5P devices, Kintex™ UltraScale+™: KU19P devices, Virtex™ UltraScale™: VU080, VU095, VU125, VU160, VU190 devices and Kintex™ UltraScale™: KU095, KU115 devices
System Logic cells up to 3,780K Logic cells and up to 3,456K Configurable Logic Blocks.
Gen3 x16/ Gen4x8 Integrated PCIe block
100G Ethernet MAC cores for high-speed connectivity
OSM Dual 64-bit Arm Cortex-A72 microprocessor subsystem at up to 2.0 GHz
4× Arm Cortex-R5F MCUs (up to 1.0GHz)
OSM module with Size-M “Medium” and Height “Flat”
32bit 2GB LPDDR4 (Expandable)
16GB eMMC Flash
2Kb EEPROM
High-speed SerDes(PCIe Gen3/ USB3.0/2.5G SGMII) x 4
Memory Dual 64bit, 4GB DDR4 with ECC for FPGA
32bit, 2GB DDR4 for FPGA
128MB QSPI Flash for FPGA
512KB SRAM via OSM SPI
2Kb EEPROM
Storage 128MB QSPI Flash for FPGA
FPGA to OSM Interfaces RGMII x1
SPI x1
UART x1
PCIe x2 Gen3
Board to Board Connector Interfaces From FPGA :

  • 74 GTY Transceiver channel up to 32Gbps
  • 120 LVDS/240SE FPGA IOs
  • FPGA JTAG x1

From OSM:

  • USB3.0 x1
  • USB2.0 x1
  • 10G Ethernet x1
  • RGMII x1
  • SD x1
  • Debug UART x 1
  • UART x 1
  • I2C x2
  • CAN x2
  • JTAG x1
Other On SOM Features TPM2.0 module
10G Ethernet PHY Transceiver
Clock Synthesizer
Temperature Sensor
Fan Header
Software Features
  • Yocto BSP, U-Boot & Vivado support
  • Linux drivers for key peripherals & Flash
  • PCIe RC/EP & DMA support
  • FPGA reference designs & DDR calibration
  • JTAG debug, firmware update & monitoring
General Features
  • Power Input: 12V through B2B Connector
  • Form Factor: 90mm x 120mm (BRYN+)
  • Operating Temperature: -40°C to +85°C
  • Environment Specification: REACH & RoHS3 Compliant

 

  • Dual Stacked QSFP112G Connector for 40G/100G Ethernet interfaces
  • Dual FMC+ HSPC Connector with high-speed transceivers and high-performance FPGA IOs
  • FMC+ HSPC connector with high-performance and high-density FPGA IOs
  • PCIe x16 Connector for PCIe x16 Gen3/PCIe x8 Gen4
  • 12G SDI Video IN through HD BNC Connector
  • 12G SDI Video OUT through HD BNC Connector
  • 4K HDMI 2.0 IN through HDMI Connector
  • 4K HDMI 2.0 OUT through HDMI Connector
  • PMOD Connector for FPGA IOs
  • USB TypeC for debug and JTAG interfaces
  • USB 2.0 & USB3.0 through TypeC Connector from OSM
  • 10G Ethernet through RJ45 Magjack from OSM
  • Gigabit Ethernet through RJ45 Magjack from OSM
  • Micro SD connector for booting of OSM
  • Coin cell battery connector for RTC backup power
  • Boot media controlling DIP switch and Hard Reset Switch
  • Operating Temperature: -20°C to +70°C
  • Form Factor: 210mm x 160mm

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